🧮 SPICE Models

Accurate behavioral models for circuit simulation and design verification.

  • IGBT Models: Temperature-dependent switching behavior
  • SiC MOSFET Models: High-frequency switching characteristics
  • Diode Models: Forward and reverse recovery modeling
  • Thermal Models: Junction temperature prediction

🌡️ Thermal Simulation

Thermal impedance models and analysis tools for heat dissipation design.

  • Thermal Networks: RC equivalent circuits
  • Junction Temperature: Transient thermal analysis
  • Cooling Design: Heatsink selection tools
  • Lifetime Prediction: Temperature cycling analysis

⚡ Loss Calculation Tools

Calculate conduction and switching losses for power module selection.

  • Conduction Losses: RDS(on) and VCEsat calculations
  • Switching Losses: Turn-on and turn-off energy
  • Total Power Loss: Efficiency optimization
  • Comparative Analysis: Module comparison tool

🎯 Module Selection Tools

Interactive tools to help you choose the optimal power module for your application.

  • Parameter Filtering: Voltage, current, package type
  • Application Matching: Use case recommendations
  • Performance Comparison: Side-by-side analysis
  • Availability Check: Stock and lead times

Featured SPICE Models

T-IGBT-H3300 Model

Comprehensive SPICE model for 3.3kV rail traction IGBT modules

  • Temperature-dependent parameters
  • Dynamic thermal modeling
  • Gate driver interface
  • Validated up to 150°C

T-SiC-M1200 Model

High-fidelity SiC MOSFET model for automotive applications

  • Fast switching behavior
  • Gate charge characteristics
  • Body diode modeling
  • High-frequency performance

Thermal RC Network

Complete thermal network models for junction temperature analysis

  • Multi-layer thermal impedance
  • Case-to-heatsink interface
  • Transient response
  • Cooling system integration

Online Calculation Tools

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Power Loss Calculator

Calculate switching and conduction losses for your specific operating conditions. Input your switching frequency, current, and temperature for accurate power loss estimation.

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Thermal Design Tool

Design your cooling system with our thermal analysis tool. Calculate junction temperatures, select appropriate heatsinks, and optimize thermal performance.

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Module Selector

Find the perfect power module for your application. Filter by voltage, current, package type, and application to get personalized recommendations.

Gate Drive Calculator

Calculate optimal gate drive parameters including gate resistor values, drive current requirements, and switching times for your IGBT or SiC modules.

Software Resources

LiTong Design Suite

Comprehensive Design Software - All-in-one tool for power module selection, thermal analysis, and loss calculation.

  • Integrated module database
  • Advanced thermal simulation
  • Loss calculation engine
  • Export to CAD formats
Version: 2.1.3 • Size: 125MB • Windows 10/11

Model Library Manager

SPICE Model Management - Organize and deploy SPICE models for your simulation environment.

  • Model version control
  • Simulator compatibility check
  • Automatic updates
  • Batch model installation
Version: 1.4.2 • Size: 45MB • Cross-platform

Need Help with Design Tools?

Our FAE team can provide training and support for all design tools and simulation models. Contact us for personalized assistance with your power electronics design.

Contact FAE Team View Training Options